The current mainstream cutting method on the market can be divided into
115 * 1 * 22 cutting disc and
super thin 115 cutting disc. Different cutting pieces can cut different products. Let me explain to you today the development status of the 115 * 1 * 22 cutting piece industry?
Compared to the traditional mortar cutting process, the cutting blade skill has the following advantages:
1. Cutting efficiency is high and the speed is improved by five times. Single-chip wafer cutting takes about 10 hours for traditional mortar cutting and only 2 hours for cutting. The high cutting efficiency is mainly due to its skill characteristics: the top of the list, the cutting piece uses a fixed method combined with diamond particles, compares the mortar line in the free state of the abrasive, not only participates in grinding and cutting more diamonds, and reduces the wear between the abrasives. Second, diamond has high hardness and high wear resistance, and then cuts and lasts longer. Third, the operating speed of the diamond fixed by the diamond wire is common to the cutting line, and the free running speed of the mortar is lower than the cutting line.
2. The data loss is small and the filming rate is high. The larger the diameter of the cutting wire, the larger the cutting edge and the more the data loss, and the wire diameter of the cutting wire is the sum of the bare wire diameter and the abrasive/edge diameter. The cutting piece has a strong cutting ability, and the plating layer is thinner than the mortar formed by mixing the cutting liquid and the silicon carbide, and then the blade loss is small. In addition, the damage layer formed by the cutting of the cutting piece is smaller than the mortar wire cutting, which is advantageous for cutting a thinner silicon wafer. Thinner wire diameters and thinner slices help reduce data loss and improve wafer yield. Now, the thickness of the silicon wafer is 180-200µm, and the mortar is cut.
The cut seam loss is about 130-150 µm, and the diamond cut of the diamond wire is about 80 µm. Thus, the cutting of the cutting piece can improve the amount of filming by about 10% to 20%.
3. Environmental pollution is small. When the mortar is cut, a polycrystalline silicon cutting waste mortar is formed. The waste mortar contains silicon carbide, polyethylene glycol, silicon powder and metal powder. The environment is large, and the silicon powder with a partial particle size of less than 0.15 µm is in contact with water or humid air. Will quickly react and release flammable gas hydrogen and heat, if not properly used, disposal will constitute severe pollution. The use of water-based grinding fluids in the diamond wire is conducive to improving the working environment and simplifying the subsequent processing procedures such as washing.
4. Product quality progress. The cutting of the cutting piece reduces the damage layer of the processing, and the accuracy is kept stable, and the TTV is small.
5. Operating costs have fallen. The equipment cost, space occupation, manpower and power consumption of the diamond cutting equipment are reduced, the whole production process is simplified, and then the operating cost is reduced
